20August2019

Nano-Micro Letters

Dipping Process Characteristics Based on Image Processing of Pictures Captured by High-speed Cameras

Junhui Li*, Yang Xia, Wei Wang, Fuliang Wang*, Wei Zhang, Wenhui Zhu

Abstract
icon-htmlFull Text Html
icon-pdf-smPDF w/ Links
icon-citExport CitationFigures

Nano-Micro Letters, January 2015, Volume 7, Issue 1, pp 1-11

First Online: December 2, 2014 (Article)

DOI:10.1007/s40820-014-0012-6

 

Abstract

 


Sequence images of dipping process of 1/4 bump height from a, Sequence images of dipping process of 1/2 bump height from b, Sequence images of dipping process of 3/4 bump height from c.

The dipping process was recorded firstly by high-speed camera system; acceleration time, speed and dipping time were set by the control system of dipping bed respectively. By image processing of dipping process based on Otsu method, it was found that low viscosity flux glue eliminates the micelle effectively, very low speed also leads to small micelle hidden between the bumps, and this small micelle and hidden phenomenon disappeared when the speed is ≥ 0.2 cm s-1. Dipping flux quantity of the bump decreases by about 100 square pixels when flux viscosity is reduced from 4500 mpa∙s to 3500 mpa∙s. For the 3500 mpa∙s viscosity glue, dipping flux quantity increases with the increase of the speed, and decreases with the increase of the speed after the speed is up to 0.8 cm s-1. The stable time of dipping glue can be obtained by real-time curve of dipping flux quantity, and is only 80-90 ms when dipping speed is from 1.6 cm s-1 to 4.0 cm s-1. Dipping flux quantity has an increasing trend for acceleration time, and has a decreasing trend for acceleration. Dipping flux quantity increases with the increase of dipping time, and is becoming saturated when the time is ≥ 55ms.

View: Full Text HTML | PDF w/ Links